High-Precision, Scalable PCBA Manufacturing Built for Complex, High-Reliability Products
Today’s products require flawless electronic performance, and we provide the in-house PCBA capabilities to support that. Fabtech-IGM is not a traditional EMS provider. We combine fully automated PCBA manufacturing, precision metal fabrication, and complete system integration into one manufacturing partner. Our Electronics manufacturing services (EMS) include SMT, through-hole, mixed-technology builds, and precision soldering performed to strict industry standards. With a focus on rapid prototyping, repeatability, and quality, we support customers who need dependable U.S.-based electronics manufacturing that can move from quick-turn prototypes to scalable production. Our integration of PCBA within the same organization as metal fabrication and assembly reduces your supply-chain complexity and ensures expedited product alignment from the board level to the finished product reducing risk, eliminating supply-chain delays, and ensuring unmatched consistency.
Why Fabtech-IGM for PCBA Manufacturing?
- Ultra-accurate SMT processing with ±20 micron print accuracy
- High-speed component placement up to 40,000 CPH
- Automated material storage for ultra-fast kitting (15–30 minutes)
- End-to-end inspection including AOI + 3D X-ray
- Full through-hole soldering options (wave + selective)
- In-circuit & functional testing built around customer specs
- Scalable for low-volume/high-mix and high-volume production
Intelligent Inventory & Automated Material Storage
Our automated storage ecosystem ensures rapid changeovers, reduced material handling errors, and faster time-to-build.
2 Mycronic SMD 2000 Storage Towers
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- Holds up to 658 reels, representing thousands of components
- Vertical dry storage optimized for MSL-sensitive parts
- Integrated with Mycenter ERP for real-time kitting and traceability
- Automated reel organization for mistake-free preparation
2 Modula Vertical Storage Towers
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- Vertical space-saving storage solution
- Operators can fully kit materials in 15–30 minutes using embedded software controls
Surface Mount Technology (SMT)
High-Accuracy SMT Assembly for Complex PCB Designs no matter the package size, shape, density, or complexity; we have the equipment to place it with absolute accuracy.
Screen Printing:
2 MPM Screen Printers
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- Wet print accuracy: ±20 microns for extremely tight tolerances
- Capable of printing boards up to 24 inches long
- Rapid 11-second cycle time for fast throughput
- Integrated 2D SPI for in-line quality verification
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Pick & Place:
4 Mycronic MY-200DX Systems
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- Up to 40,000 CPH rated speed
- Intelligent feeders for automatic component recognition
- Average changeover time: 20 minutes
- Dual-head beam for high throughput
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High Precision MIDAS Head:
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- Places components from 01005 up to 56 × 56 mm
- Supports BGA, QFP, flip-chip, odd-shape, CSP, CCGA, connectors, and more
- Supports up to 140 g component weight
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High Speed HYDRA Z8 Head:
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- Optimized for 0201 chips through PLCC44
- Supports MELF, SOIC, SOT223, TSOP, and similar components
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Reflow Soldering:
2 Vitronics Soltec XPM3m Reflow Ovens
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- 10-zone thermal profiling for tight process control
- Nitrogen capability for void reduction and improved solder quality
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At Fabtech-IGM, we combine technology, automation, and disciplined manufacturing to help you bring products to market faster, more reliably, and with complete confidence in every board.
Whether you’re scaling up production, refreshing your supply chain, or launching a new design, our team is ready to support your next build.
Through-Hole Soldering Capabilities
Vitronics Soltec Delta X Wave Soldering
- Ideal for medium-to-high volumes
- Uniform, repeatable wave performance
Juki iCube Selective Soldering
- Dual-pot design for multiple nozzle sizes
- Enables selective, precise soldering on dense or mixed-technology boards
Testing & Validation
In-Circuit Testing (ICT):
- Fully equipped Teradyne Test Station LH
- All boards tested to customer functional specifications
Automated Optical Inspection (AOI) Advanced AOI ensures early-stage defect detection and near-zero rework downstream.
2 Mirtec MV-7U AOI Machines
- 5-camera inline optical system
- 13.4 micron/pixel telecentric lenses
- Lifted-lead detection for gullwing packages
X-Ray Inspection & Quality Control – Perfect for verifying hidden solder joints and guaranteeing long-term reliability.
Nordson Dage Quadra 5 X-Ray System
- Automatic BGA/QFN void calculation with reporting
- 3D imaging via X-Plane for joint-level visualization
- Automated X-Ray inspection for high-density assemblies
- Functional Testing: Ensures every board meets electrical, functional, and safety criteria before shipment. Customized per customer/product requirements.
Certifications & Quality Assurance
- ISO 9001:2015 certified
- IPC J-STD-001/IPC-A-610 certified (hyperlink to the certificate)
- RoHS Compliant
- REACH Compliant
- IPC-A-610 Certified Trainers
- ANSI/ESD S20.20-202 compliant ESD Program
- Documented process control
- Full part traceability
- Repeatability via automation and real-time monitoring
Contact
Libertyville, IL
| 1925 Enterprise Ct. Libertyville, IL 60048 |
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| (847) 362-9800 | |
| sales@fabtech-igm.com |
Las Vegas, NV
| 7445 Dean Martin Dr STE 112 Las Vegas, NV 89139 |
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| (702) 629-2222 | |
| sales@fabtech-igm.com |
Certifications & Compliance
IPC J-STD-001 and IPC-A-610
ISO9001:2015
UL 508A Certified Panel Shop
NEMA and UL Rated Enclosures
NEMA Make It American (Pending)
Legal
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